Pullsar Ice Dragon® Ultra/Thermal - Termal pad / 20.0 W.m*k /100 * 50 (2.00)
XOF 22120
Price Details
Excluding Shipping & Custom charges ( Shipping and custom charges will be calculated on checkout )
*All items will import from TR
QTY:
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Get maximum efficiency and ultra performance with Pullsar ICE DRAGON ULTRA Thermal Pads.
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What Stands Out
Product Details
| Marka Adı | Pullsar |
| Üretici | Deniport |
| UPC | 743407914869 |
| Parça Numarası | PIDU |
| Montaj Türü | PCB Montaj |
| CPU Soketi | LGA 1200, AM4 |
| Soğutucu Isı Yutucu Malzemesi | Alüminyum |
| Marka | Pullsar |
| Soğutucu Isı Alıcı Malzemesi | Alüminyum |
| Montaj Tipi | PCB Montaj |
| Item Weight | 1.5 lbs (680 grams) |
Who Should Buy?
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Computer Builders
Ideal for assembling high-performance PCs needing effective thermal management and improved heat dissipation for optimal performance.
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Overclocking Enthusiasts
Perfect for users looking to push their hardware limits, ensuring stable temperatures during intense processing activities.
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Gaming Professionals
Great for maintaining thermal stability in gaming rigs, enhancing performance and longevity during extended gameplay sessions.
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Casual Users
May be excessive for basic users who do not demand high thermal performance or advanced heat management solutions.
Product Description
Customer Questions & Answers
-
Question:
What is the thermal conductivity of the ICE DRAGON ULTRA?
Answer: The thermal conductivity is 20.0 W/mk. -
Question:
What is the thickness of the thermal pad?
Answer: The thickness of the ICE DRAGON ULTRA Thermal Pad is 0.50 mm. -
Question:
What is the application temperature range?
Answer: The application temperature range is -50 to 150 degrees Celsius.
Pullsar Editorial Review
Pullsar Ice Dragon® Ultra/Thermal is a high-performance thermal pad designed to ensure optimal heat transfer with a thermal conductivity of 20.0 W.m*k. Made by Pullsar, this thermal pad features aluminum as its primary material, providing robust effectiveness in cooling applications. It's compatible with various CPU sockets, including LGA 1200 and AM4, making it versatile for different builds. Users appreciate how easy it is to install, thanks to the PCB mounting type, and many have noted improvements in their system's temperature management after using this product.
Customer Reviews & Ratings
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5 Star
47%
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4 Star
12%
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3 Star
13%
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2 Star
15%
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1 Star
13%
Review this product
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Pros
- High thermal conductivity for efficient heat transfer
- Compatible with LGA 1200 and AM4 sockets
- Easy installation with PCB mounting design
- Durable aluminum construction for longevity
- Lightweight design at 1.5 lbs for easy handling
Cons
- Bulkier than some other thermal pads on the market
Platform Trust & Buyer Confidence
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XOF 22120
Order now and get it around Wednesday, October 07
This item is not restrict in my country.(Please click on above link if this item is not restrict in your country, So our team will review and allow.)
QTY:
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Features & Benefits
- Engineered for superior quality and performance.
- Guarantees maximum conductivity throughout its lifespan.
- Responds quickly to temperature changes with low response time.
- Ultra-high conductivity efficiently transfers heat away from chipsets.
- Ideal for gamers and mining graphics cards.
- Maintains maximum efficiency until the maintenance cycle.
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